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Controlled bacteriostasis of tea polyphenol loaded ultrahigh molecular weight polyethylene with high crosslink density and oxidation resistance for total joint replacement.

Authors :
Wang FY
Ren Y
Lan RT
Fu WQ
Chen ZJ
Huang S
Gul RM
Wang J
Xu JZ
Li ZM
Source :
Materials science & engineering. C, Materials for biological applications [Mater Sci Eng C Mater Biol Appl] 2021 May; Vol. 124, pp. 112040. Date of Electronic Publication: 2021 Mar 24.
Publication Year :
2021

Abstract

To avoid catastrophic bacterial infection in prosthesis failure, ultrahigh molecular weight polyethylene (UHMWPE), a common bearing material of artificial joints, has been formulated with antibiotics to eliminate bacteria locally at the implant site. However, the pressing issues regarding cytotoxic effects and evolution of drug resistant bacteria necessitates the development of bio-friendly bacteriostat with long bacteriostatic efficacy. Herein, tea polyphenol extracted from nature source was introduced in UHMWPE as a biogenic antimicrobial. Controlled antimicrobial activity was achieved by chemical crosslinking to regulate the release of the tea polyphenol. In addition, the crosslinking efficiency of UHMWPE blends with high loaded tea polyphenol was significantly improved in comparison to radiation crosslinking. The immobilized tea polyphenols also enhanced the oxidation stability of the UHMWPE, which is essential to prolong the service life in vivo and the storage time in vitro. The blends presented good biocompatibility, despite cell repellent on the highly crosslinked surface. Chemically crosslinked tea polyphenol/UHMWPE exhibited feasible properties for total joint implants, which is promising for clinical application.<br /> (Copyright © 2021 Elsevier B.V. All rights reserved.)

Details

Language :
English
ISSN :
1873-0191
Volume :
124
Database :
MEDLINE
Journal :
Materials science & engineering. C, Materials for biological applications
Publication Type :
Academic Journal
Accession number :
33947540
Full Text :
https://doi.org/10.1016/j.msec.2021.112040