Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration.

MLA

Suchý, Tomáš, et al. “Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. Epidermidis Infection and Enhance Osseointegration.” Biomedicines, vol. 9, no. 5, May 2021. EBSCOhost, https://doi.org/10.3390/biomedicines9050531.

APA

Suchý, T., Vištejnová, L., Šupová, M., Klein, P., Bartoš, M., Kolinko, Y., Blassová, T., Tonar, Z., Pokorný, M., Sucharda, Z., Žaloudková, M., Denk, F., Ballay, R., Juhás, Š., Juhásová, J., Klapková, E., Horný, L., Sedláček, R., Grus, T., … Hrabák, J. (2021). Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration. Biomedicines, 9(5). https://doi.org/10.3390/biomedicines9050531

Chicago

Suchý, Tomáš, Lucie Vištejnová, Monika Šupová, Pavel Klein, Martin Bartoš, Yaroslav Kolinko, Tereza Blassová, et al. 2021. “Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. Epidermidis Infection and Enhance Osseointegration.” Biomedicines 9 (5). doi:10.3390/biomedicines9050531.