Back to Search Start Over

Micropatterned Elastomeric Composites for Encapsulation of Transient Electronics.

Authors :
Han WB
Ko GJ
Yang SM
Kang H
Lee JH
Shin JW
Jang TM
Han S
Kim DJ
Lim JH
Rajaram K
Bandodkar AJ
Hwang SW
Source :
ACS nano [ACS Nano] 2023 Aug 08; Vol. 17 (15), pp. 14822-14830. Date of Electronic Publication: 2023 Jul 27.
Publication Year :
2023

Abstract

Although biodegradable, transient electronic devices must dissolve or decompose via environmental factors, an effective waterproofing or encapsulation system is essential for reliable, durable operation for a desired period of time. Existing protection approaches use multiple or alternate layers of electrically inactive organic/inorganic elements combined with polymers; however, their high mechanical stiffness is not suitable for soft, time-dynamic biological tissues/skins/organs. Here, we introduce a stretchable, bioresorbable encapsulant using nanoparticle-incorporated elastomeric composites with modifications of surface morphology. Nature-inspired micropatterns reduce the diffusion area for water molecules, and embedded nanoparticles impede water permeation, which synergistically enhances the water-barrier performance. Empirical and theoretical evaluations validate the encapsulation mechanisms under strains. Demonstration of a soft, degradable shield with an optical component under a biological solution highlights the potential applicability of the proposed encapsulation strategy.

Details

Language :
English
ISSN :
1936-086X
Volume :
17
Issue :
15
Database :
MEDLINE
Journal :
ACS nano
Publication Type :
Academic Journal
Accession number :
37497757
Full Text :
https://doi.org/10.1021/acsnano.3c03063