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Signature Driven Hierarchical Post-Manufacture Tuning of RF Systems for Performance and Power.
- Source :
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems; Feb2015, Vol. 23 Issue 2, p342-355, 14p
- Publication Year :
- 2015
-
Abstract
- Integration of RF circuits in deeply scaled CMOS technologies and severe process variation in those technology nodes result in poor manufacturing yield. A post-manufacture tuning approach for yield improvement of RF systems is developed in this paper that uses hierarchical behavioral models of the RF systems. The proposed method first determines module-level performances from the system-level response (signature) to an applied test using top-down model diagnosis. Then, constrained optimization is performed to determine the best module-level tuning parameter values that satisfy system-level specifications (bottom-up analysis) in a power-conscious manner. Both top-down and bottom-up analysis techniques are supported by hierarchical RF behavioral models. The relationship between module-level tuning parameters and module-level performance metrics changes from instance to instance depending on amount of process variation and this factor is included in the proposed tuning procedure. A key benefit of the proposed approach is that only a single-test application is needed at a fixed number of tuning knob settings resulting in reduction in tuning time. The efficiency of the proposed technique is demonstrated using simulation results and hardware experiment. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 10638210
- Volume :
- 23
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Publication Type :
- Academic Journal
- Accession number :
- 100777026
- Full Text :
- https://doi.org/10.1109/TVLSI.2014.2309114