Impact on signal integrity of interconnect variabilities.

Authors :: Manfredi, Paolo
Vande Ginste, Dries
De Zutter, Danieul
Canavero, Flavio G.
Source :: 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC); 2014, p673-678, 6p
Publication Year :: 2014

Language :: English
ISBNs :: 9781479955442
Database :: Complementary Index
Journal :: 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Publication Type :: Conference
Accession number :: 101216615
Full Text :: https://doi.org/10.1109/ISEMC.2014.6899054