Cite
TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip.
MLA
Eghbal, Ashkan, et al. “TSV-to-TSV Inductive Coupling-Aware Coding Scheme for 3D Network-on-Chip.” 2014 IEEE International Symposium on Defect & Fault Tolerance in VLSI & Nanotechnology Systems (DFT), Jan. 2014, pp. 92–97. EBSCOhost, https://doi.org/10.1109/DFT.2014.6962067.
APA
Eghbal, A., Yaghini, P. M., Yazdi, S. S., & Bagherzadeh, N. (2014). TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip. 2014 IEEE International Symposium on Defect & Fault Tolerance in VLSI & Nanotechnology Systems (DFT), 92–97. https://doi.org/10.1109/DFT.2014.6962067
Chicago
Eghbal, Ashkan, Pooria M. Yaghini, Siavash S. Yazdi, and Nader Bagherzadeh. 2014. “TSV-to-TSV Inductive Coupling-Aware Coding Scheme for 3D Network-on-Chip.” 2014 IEEE International Symposium on Defect & Fault Tolerance in VLSI & Nanotechnology Systems (DFT), January, 92–97. doi:10.1109/DFT.2014.6962067.