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A Si-Micromachined 162-Stage Two-Part Knudsen Pump for On-Chip Vacuum.
- Source :
- Journal of Microelectromechanical Systems; Apr2014, Vol. 23 Issue 2, p406-416, 11p
- Publication Year :
- 2014
-
Abstract
- This paper investigates a two-part architecture for a Knudsen vacuum pump with no moving parts. This type of pump exploits the thermal transpiration that results from the free-molecular flow in nonisothermal channels. For a high compression ratio, 162 stages are serially cascaded. The two-part architecture uses 54 stages designed for the pressure range from 760 to ≈ 50 Torr, and 108 stages designed for lower pressures. This approach provides greater compression ratio and speed than using a uniform design for each stage. Finite element simulations and analytical design analysis are presented. A five-mask single-wafer fabrication process is used for monolithic integration of the Knudsen pump that has a footprint of 12 × 15 mm2. The pressure levels of each stage are measured by integrated Pirani gauges. Experimental evaluation shows that, using an input power of ≈ 0.39 W, the evacuated chamber is reduced from 760 to ≈ 0.9 Torr, resulting in a compression ratio of ≈ 844. The vacuum levels are sustained during 37 days of continuous operation. [ABSTRACT FROM AUTHOR]
- Subjects :
- MICROPUMPS
KNUDSEN flow
HEAT transfer
VACUUM
MICROFABRICATION
Subjects
Details
- Language :
- English
- ISSN :
- 10577157
- Volume :
- 23
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- Journal of Microelectromechanical Systems
- Publication Type :
- Academic Journal
- Accession number :
- 101290556
- Full Text :
- https://doi.org/10.1109/JMEMS.2013.2281316