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Thermal-aware Steiner routing for 3D stacked ICs.

Authors :
Pathak, Mohit
Lim, Sung Kyu
Source :
Proceedings of the 2007 IEEE ACM International Conference Computer-aided Design; 11/5/2007, p205-211, 7p
Publication Year :
2007

Details

Language :
English
Database :
Complementary Index
Journal :
Proceedings of the 2007 IEEE ACM International Conference Computer-aided Design
Publication Type :
Conference
Accession number :
101417549

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