Fabrication and characterization of carbon nanotube interconnect vias for next-generation technology nodes.

Details

Language :

English

ISBNs :

9781479923342

Database :

Complementary Index

Journal :

2014 IEEE International Conference on Electron Devices & Solid-State Circuits

Publication Type :

Conference

Accession number :

102525477

Full Text :

https://doi.org/10.1109/EDSSC.2014.7061272