Cite
3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes.
MLA
Hu, Yu-Chen, et al. “3D Heterogeneous Integration Structure Based on 40 Nm- and 0.18 Μm-Technology Nodes.” 2015 IEEE 65th Electronic Components & Technology Conference (ECTC), Jan. 2015, pp. 1646–51. EBSCOhost, https://doi.org/10.1109/ECTC.2015.7159817.
APA
Hu, Y.-C., Lin, C.-P., Hsieh, Y.-S., Chang, N.-S., Gallegos, A. J., Souza, T., Chen, W.-C., Sheu, M.-H., Chang, C.-C., Chen, C.-S., & Chen, K.-N. (2015). 3D heterogeneous integration structure based on 40 nm- and 0.18 µm-technology nodes. 2015 IEEE 65th Electronic Components & Technology Conference (ECTC), 1646–1651. https://doi.org/10.1109/ECTC.2015.7159817
Chicago
Hu, Yu-Chen, Chun-Pin Lin, Yu-Sheng Hsieh, Nien-Shyang Chang, Anthony J. Gallegos, Terry Souza, Wei-Chia Chen, et al. 2015. “3D Heterogeneous Integration Structure Based on 40 Nm- and 0.18 Μm-Technology Nodes.” 2015 IEEE 65th Electronic Components & Technology Conference (ECTC), January, 1646–51. doi:10.1109/ECTC.2015.7159817.