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Influence of thermally activated processes on the deformation behavior during low temperature ECAP.

Authors :
S Fritsch
M Scholze
M F-X Wagner
Source :
IOP Conference Series: Materials Science & Engineering; 2016, Vol. 118 Issue 1, p1-1, 1p
Publication Year :
2016

Details

Language :
English
ISSN :
17578981
Volume :
118
Issue :
1
Database :
Complementary Index
Journal :
IOP Conference Series: Materials Science & Engineering
Publication Type :
Academic Journal
Accession number :
113768100
Full Text :
https://doi.org/10.1088/1757-899X/118/1/012030