Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes.

Details

Language :

English

ISBNs :

9784904090176

Database :

Complementary Index

Journal :

2016 International Conference on Electronics Packaging (ICEP)

Publication Type :

Conference

Accession number :

116451512

Full Text :

https://doi.org/10.1109/ICEP.2016.7486783