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Study on current and junction temperature stress aging effect for accelerated aging test of Light emitting diodes.
- Source :
- 2016 International Conference on Electronics Packaging (ICEP); 2016, p62-65, 4p
- Publication Year :
- 2016
Details
- Language :
- English
- ISBNs :
- 9784904090176
- Database :
- Complementary Index
- Journal :
- 2016 International Conference on Electronics Packaging (ICEP)
- Publication Type :
- Conference
- Accession number :
- 116451512
- Full Text :
- https://doi.org/10.1109/ICEP.2016.7486783