Normally-off p-GaN/AlGaN/GaN high electron mobility transistors using hydrogen plasma treatment.

In this letter, we report a method by introducing hydrogen plasma treatment to realize normally-off p-GaN/AlGaN/GaN HEMT devices. Instead of using etching technology, hydrogen plasma was adopted to compensate holes in the p-GaN above the two dimensional electron gas (2DEG) channel to release electrons in the 2DEG channel and form high-resistivity area to reduce leakage current and increase gate control capability. The fabricated p-GaN/AlGaN/GaN HEMT exhibits normallyoff operation with a threshold voltage of 1.75 V, a subthreshold swing of 90 mV/dec, a maximum transconductance of 73.1 mS/mm, an ON/OFF ratio of 1×10⁷, a breakdown voltage of 393 V, and a maximum drain current density of 188 mA/mm at a gate bias of 6V. The comparison of the two processes of hydrogen plasma treatment and p-GaN etching has also been made in this work. [ABSTRACT FROM AUTHOR]