Nanostructure formation on silicon surfaces by using low energy helium plasma exposure.

A new technology for obtaining nanostructure on silicon surface for potential applications to optical devices is represented. Scanning electron microscope analysis indicated a grown nanostructure of dense forest consisting of long cylindrical needle cones with a length of approximately 300 nm and a mutual distance of approximately 200 nm. Raman spectroscopy and spectrophotometry showed a good crystallinity and photon trapping, and reduced light reflectance after helium plasma exposure. The present technique consists of a simple maskless process that circumvents the use of chemical etching liquid, and utilizes soft ion bombardment on silicon substrate, keeping a good crystallinity. [ABSTRACT FROM AUTHOR]