AlO-CuO composite charge-trapping nonvolatile memory.

In this work, we have fabricated and thoroughly characterized dielectric-stacked memory devices with AlO-CuO composites as the charge trapping layer which are prepared by using atomic layer deposition and RF-magnetron sputtering techniques. The devices exhibit a large memory window of 13.27 V and a density of the trapped charges of 9.37 × 10 cm at a working voltage of ±11 V. The microstructural observations by using high resolution transmission electron microscopy and the analysis on X-ray photoelectron spectroscopy indicate that the strong charge-trapping ability of AlO-CuO composite should be ascribed to the occurrence of Cu, resulted by the inter-diffusion at the interface of CuO/AlO. Such an interesting composite layer has very attractive application in nonvolatile memory. [ABSTRACT FROM AUTHOR]