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基于半导体制冷的巧克力3D打印成型条件研究.

Authors :
周世浩
谭跃刚
张帆
陈飞
蒋世齐
Source :
Journal of Mechanical & Electrical Engineering; Apr2017, Vol. 34 Issue 4, p351-356, 6p
Publication Year :
2017

Abstract

<i>Copyright of Journal of Mechanical & Electrical Engineering is the property of Mechanical & Electrical Engineering Magazine and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)

Details

Language :
Chinese
ISSN :
10014551
Volume :
34
Issue :
4
Database :
Complementary Index
Journal :
Journal of Mechanical & Electrical Engineering
Publication Type :
Academic Journal
Accession number :
123347103
Full Text :
https://doi.org/10.3969/j.issn.1001-4551.2017.04.006