Back to Search Start Over

Reduced Junction Leakage by Hot Phosphorus Ion Implantation of NiGe-Contacted Germanium n+/p Shallow Junction.

Authors :
Chen, Yi-Ju
Tsui, Bing-Yue
Chou, Hung-Ju
Li, Ching-i.
Lin, Ger-Pin
Hu, Shao-Yu
Source :
IEEE Electron Device Letters; Sep2017, Vol. 38 Issue 9, p1192-1195, 4p
Publication Year :
2017

Abstract

Effects of hot phosphorus (P) implantation on the NiGe-contacted Ge n+/p junction are studied in this work. At an adequately high ion-implantation temperature (150°C), the P depth profiles of the hot-implanted samples are similar to that of the room-temperature implanted ones. Hot P implantation is demonstrated effectively in reducing ion implantation induced defect formation and suppressing nickel atoms diffusion. Therefore, hot P implantation is efficient in lowering junction leakage and excellent junction characteristics exhibiting \sim 1\times 10^6~J \mathrm{\scriptscriptstyle ON}/J \mathrm{\scriptscriptstyle OFF} ratio is achieved. [ABSTRACT FROM PUBLISHER]

Details

Language :
English
ISSN :
07413106
Volume :
38
Issue :
9
Database :
Complementary Index
Journal :
IEEE Electron Device Letters
Publication Type :
Academic Journal
Accession number :
124835198
Full Text :
https://doi.org/10.1109/LED.2017.2726086