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Reduced Junction Leakage by Hot Phosphorus Ion Implantation of NiGe-Contacted Germanium n+/p Shallow Junction.
- Source :
- IEEE Electron Device Letters; Sep2017, Vol. 38 Issue 9, p1192-1195, 4p
- Publication Year :
- 2017
-
Abstract
- Effects of hot phosphorus (P) implantation on the NiGe-contacted Ge n+/p junction are studied in this work. At an adequately high ion-implantation temperature (150°C), the P depth profiles of the hot-implanted samples are similar to that of the room-temperature implanted ones. Hot P implantation is demonstrated effectively in reducing ion implantation induced defect formation and suppressing nickel atoms diffusion. Therefore, hot P implantation is efficient in lowering junction leakage and excellent junction characteristics exhibiting \sim 1\times 10^6~J \mathrm{\scriptscriptstyle ON}/J \mathrm{\scriptscriptstyle OFF} ratio is achieved. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 07413106
- Volume :
- 38
- Issue :
- 9
- Database :
- Complementary Index
- Journal :
- IEEE Electron Device Letters
- Publication Type :
- Academic Journal
- Accession number :
- 124835198
- Full Text :
- https://doi.org/10.1109/LED.2017.2726086