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Erratum to: Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.
- Source :
- Journal of Electronic Materials; Nov2017, Vol. 46 Issue 11, p6737-6737, 1p
- Publication Year :
- 2017
-
Abstract
- A correction to the article "Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints," by Shenga Liu and colleagues published in an issue of the journal is presented.
- Subjects :
- SOLDER joints
MICROSTRUCTURE
Subjects
Details
- Language :
- English
- ISSN :
- 03615235
- Volume :
- 46
- Issue :
- 11
- Database :
- Complementary Index
- Journal :
- Journal of Electronic Materials
- Publication Type :
- Academic Journal
- Accession number :
- 125430426
- Full Text :
- https://doi.org/10.1007/s11664-017-5716-1