Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.

MLA

Liu, Shengfa, et al. “Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as Well as the Mechanical Properties of Solder Joints.” Journal of Electronic Materials, vol. 46, no. 11, Nov. 2017, pp. 6373–80. EBSCOhost, https://doi.org/10.1007/s11664-017-5672-9.

APA

Liu, S., Hu, Z., Xiong, J., Tan, G., Xiong, W., Chen, C., & Huang, S. (2017). Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints. Journal of Electronic Materials, 46(11), 6373–6380. https://doi.org/10.1007/s11664-017-5672-9

Chicago

Liu, Shengfa, Zhebing Hu, Jieran Xiong, Guanghua Tan, Wenyong Xiong, Chen Chen, and Shangyu Huang. 2017. “Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as Well as the Mechanical Properties of Solder Joints.” Journal of Electronic Materials 46 (11): 6373–80. doi:10.1007/s11664-017-5672-9.