A Wideband Model for On-Chip Interconnects With Different Shielding Structures.

In this paper, a wideband model for on-chip interconnects with different shielding structures is proposed. In order to improve the performance of interconnects, solid ground, floating shields, and parallel ground shields are often employed in real applications. Based on the transmission line theory and electromagnetic wave theory, these three different shielding structures are analyzed and discussed. Also, many parasitic effects such as eddy current, skin effect, proximity effect, and substrate loss have been taken into consideration to improve the precision of the proposed model. It is shown that the simulated results of the model are in good agreement with the measured ones up to 110 GHz. The validity of the proposed model has been proven. [ABSTRACT FROM PUBLISHER]