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A Low-Cost NiO Hole Transfer Layer for Ohmic Back Contact to Cu2O for Photoelectrochemical Water Splitting.
- Source :
- Small; 10/18/2017, Vol. 13 Issue 39, pn/a-N.PAG, 7p
- Publication Year :
- 2017
Details
- Language :
- English
- ISSN :
- 16136810
- Volume :
- 13
- Issue :
- 39
- Database :
- Complementary Index
- Journal :
- Small
- Publication Type :
- Academic Journal
- Accession number :
- 125686616
- Full Text :
- https://doi.org/10.1002/smll.201702007