Hybrid particleboard from kadam ( Anthocephalus chinensis) reinforced with dhaincha ( Sesbania aculeata): effects of particle mixing ratio on physical and mechanical properties.

This study deals with the fabrication of three layer hybrid particleboard using kadam branch ( Anthocephalus chinensis ( Lam.) A. Rich ex Walp.) and dhaincha ( Sesbania aculeata ( Willd.)) as raw material with urea formaldehyde resin adhesive as 11% in the face and 9% in the core. Two types of particleboard i.e., dhaincha fine particles: face layer and kadam wood coarse particles:core layer (HB-A) and dhaincha kadam fine mix:face layer and coarse mix:core layer (HB-B) were produced by using three different mixing ratios (50:50, 60:40 and 70:30). Physical and mechanical properties of hybrid particleboards were evaluated according to the procedure of ASTM D-1037 standard. It was found that the particle mixing ratio has a significant effect on the physical and mechanical properties of hybrid particleboards. Consequently, containing lower face layer (30 wt%), the HB-A and HB-B board showed highest density (0.61 and 0.64 g/cm, respectively) as well as MOE (2.56 and 3.56 GPa, respectively) and MOR (18.6 and 26.62 MPa, respectively) among hybrid particleboards. Presence of wood fine particles in face layer also proved effective in properties enhancement. Due to having wood fine particles content in face layer, HB-B type hybrid boards showed higher density and bending strength than HB-A boards. Presence of wood particles in face layer also reduces the WA and TS of the boards. Significant difference was examined among the properties of six particleboards during statistical analysis. The results confirmed that HB-A3 and HB-B3 particleboards met the minimum ANSI A208.1 requirements for physical and mechanical properties of M-3 grade particleboard. In decay resistance test, HB-A type particleboards showed resistance to white rot, but non-resistant for brown rot fungi where the HB-B type particleboards showed moderately resistant to both fungi. So the results indicated that the fabrication HB-B type hybrid particleboards would be technically feasible under lower face layer percentage. [ABSTRACT FROM AUTHOR]