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A 9-mm2 Ultra-Low-Power Highly Integrated 28-nm CMOS SoC for Internet of Things.

Authors :
Pu, Yu
Shi, Chunlei
Samson, Giby
Park, Dongkyu
Easton, Ken
Beraha, Rudy
Newham, Adam
Lin, Mark
Rangan, Venkat
Chatha, Karam
Butterfield, Danny
Attar, Rashid
Source :
IEEE Journal of Solid-State Circuits; Mar2018, Vol. 53 Issue 3, p936-948, 13p
Publication Year :
2018

Abstract

This paper gives an overview of the Blackghost 1.0 system-on-chip (SoC) from Qualcomm Research, which was our first test chip that paved the way toward the commercialization of Qualcomm’s most recent ultra-low-power Blackghost SoC family. Specifically designed for battery powered Internet of Things, sensor fusion, wearables, and e-medical applications, this highly integrated SoC delivers high-power efficiency through low-power innovations in architecture and circuit domains. It integrates a small footprint sensor control processor based on ARM Cortex-M0, a vision classifier processor, a streaming DSP hardware accelerator, an ultra-low-power analog-front-end, and an on-die power management unit with direct Li-Ion battery attach capability. The die size of this prototype chip is $3\times 3$ mm2 in a 28LP CMOS process technology. To date, this SoC family has successfully progressed to the mass production of near-threshold computing. The logic computation operates at near-threshold voltages (<0.6 V) at frequencies up to 50 MHz and draws less than $9~\mu $ A/MHz from the directly attached battery. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00189200
Volume :
53
Issue :
3
Database :
Complementary Index
Journal :
IEEE Journal of Solid-State Circuits
Publication Type :
Academic Journal
Accession number :
128188883
Full Text :
https://doi.org/10.1109/JSSC.2017.2783680