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Wafer‐Scale Fabrication of Ultrathin Flexible Electronic Systems via Capillary‐Assisted Electrochemical Delamination.
- Source :
- Advanced Materials; 12/13/2018, Vol. 30 Issue 50, pN.PAG-N.PAG, 1p
- Publication Year :
- 2018
Details
- Language :
- English
- ISSN :
- 09359648
- Volume :
- 30
- Issue :
- 50
- Database :
- Complementary Index
- Journal :
- Advanced Materials
- Publication Type :
- Academic Journal
- Accession number :
- 133481888
- Full Text :
- https://doi.org/10.1002/adma.201805408