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A Self-Rectifying Resistive Switching Device Based on HfO2/TaO $_{{x}}$ Bilayer Structure.
- Source :
- IEEE Transactions on Electron Devices; Feb2019, Vol. 66 Issue 2, p924-928, 5p
- Publication Year :
- 2019
-
Abstract
- To effectively solve the crosstalk issue in high-density crossbar array (CBA), high rectifying characteristics should be introduced in the resistance random-access memory (ReRAM) device, and in-depth understanding of the affecting factors on rectifying properties is essential for the large-scale application of ReRAM. In this paper, a high-performance self-rectifying device with CMOS compatible Pd/HfO2/TaOx/Ta structure was demonstrated in a 1-kb CBA. Forming-free, self-compliance, and high uniformity characteristics were successfully achieved. By modulating the thickness of the HfO2 rectifying layer, the rectifying ratio of device could be achieved as high as $\sim 2\times 10^{\textsf {3}}$ under ±3 V at low-resistance state (LRS). It was also experimentally confirmed that the selected unit cell in high-resistance state (logically the “ OFF” state) was stably readable when it was surrounded by unselected LRS (logically the “ ON” state) cells, in an array of up to $32 \times 32$ cells. Furthermore, a model based on interfacial barrier modulation and defects trapping/detrapping was proposed to elucidate the impact of the dielectric thickness on the self-rectifying characteristics of the device. The results presented in this paper provide a great potential for selector-free high-density memory applications. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 66
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- 134552108
- Full Text :
- https://doi.org/10.1109/TED.2018.2883192