Study on chemical bonding states at electrode–silicon interface fabricated with fire-through control paste.

MLA

Takuya Hiyama, et al. “Study on Chemical Bonding States at Electrode–silicon Interface Fabricated with Fire-through Control Paste.” Japanese Journal of Applied Physics, vol. 57, no. 8S3, Aug. 2018, p. 1. EBSCOhost, https://doi.org/10.7567/JJAP.57.08RB23.

APA

Takuya Hiyama, Takuto Kojima, Kosuke Kinoshita, Tappei Nishihara, Kohei Onishi, Kazuo Muramatsu, Aki Tanaka, Yoshio Ohshita, & Atsushi Ogura. (2018). Study on chemical bonding states at electrode–silicon interface fabricated with fire-through control paste. Japanese Journal of Applied Physics, 57(8S3), 1. https://doi.org/10.7567/JJAP.57.08RB23

Chicago

Takuya Hiyama, Takuto Kojima, Kosuke Kinoshita, Tappei Nishihara, Kohei Onishi, Kazuo Muramatsu, Aki Tanaka, Yoshio Ohshita, and Atsushi Ogura. 2018. “Study on Chemical Bonding States at Electrode–silicon Interface Fabricated with Fire-through Control Paste.” Japanese Journal of Applied Physics 57 (8S3): 1. doi:10.7567/JJAP.57.08RB23.