Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications.

MLA

Collin, Louis-Michel, et al. “Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 9, no. 3, Mar. 2019, pp. 434–45. EBSCOhost, https://doi.org/10.1109/TCPMT.2018.2874241.

APA

Collin, L.-M., Colonna, J.-P., Coudrain, P., Shirazy, M. R. S., Cheramy, S., Souifi, A., & Frechette, L. G. (2019). Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications. IEEE Transactions on Components, Packaging & Manufacturing Technology, 9(3), 434–445. https://doi.org/10.1109/TCPMT.2018.2874241

Chicago

Collin, Louis-Michel, Jean-Philippe Colonna, Perceval Coudrain, Mahmood R. S. Shirazy, Severine Cheramy, Abdelkader Souifi, and Luc G. Frechette. 2019. “Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology 9 (3): 434–45. doi:10.1109/TCPMT.2018.2874241.