Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition.

MLA

Wan Yusoff, Wan Yusmawati, et al. “Correlation of Microstructural Evolution and Hardness Properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) Lead-Free Solder under Blast Wave Condition.” Soldering & Surface Mount Technology, vol. 31, no. 2, Apr. 2019, pp. 102–08. EBSCOhost, https://doi.org/10.1108/SSMT-06-2018-0019.

APA

Wan Yusoff, W. Y., Ismail, N., Safee, N. S., Ismail, A., Jalar, A., & Abu Bakar, M. (2019). Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition. Soldering & Surface Mount Technology, 31(2), 102–108. https://doi.org/10.1108/SSMT-06-2018-0019

Chicago

Wan Yusoff, Wan Yusmawati, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, and Maria Abu Bakar. 2019. “Correlation of Microstructural Evolution and Hardness Properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) Lead-Free Solder under Blast Wave Condition.” Soldering & Surface Mount Technology 31 (2): 102–8. doi:10.1108/SSMT-06-2018-0019.