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Effect of Cu on microstructure, magnetic properties of antiperovskite nitrides CuxNFe4−x.

Authors :
Wang, Wei
Kan, Xucai
Liu, Xiansong
Feng, Shuangjiu
Liu, Chaocheng
Mehmood Ur Rehman, Khalid
Shezad, Mudssir
Wu, Qiuyue
Wang, Yuanyuan
Source :
Journal of Materials Science: Materials in Electronics; Jun2019, Vol. 30 Issue 11, p10383-10390, 8p
Publication Year :
2019

Abstract

For soft magnetic materials, especially new intermetallic compounds, some good soft magnetic properties, such as high permeability, low power loss, as well as superior DC-bias properties, will determine their prospects for application. In this paper, we report soft magnetic properties of Cu<subscript>x</subscript>NFe<subscript>4−x</subscript>, prepared by a new synthetic method. Although the saturation magnetization of the samples is slightly lower than that of Fe<subscript>4</subscript>N due to Cu doping, various other experimental results clearly provide evidence that the Fe substitution by Cu leads to the optimization and improvement of soft magnetic properties in Fe<subscript>4</subscript>N. With increasing Cu content, the permeability increases and power loss reduces from 1064.5 mW/cm<superscript>3</superscript> for x = 0.1 to 679 mW/cm<superscript>3</superscript> for x = 0.5 at H = 8 A/m, f = 1000 kHz. Additionally, the value of DC-bias (μ<subscript>H</subscript>/μ<subscript>H</subscript><subscript>=</subscript><subscript>0</subscript>) rises above 82% at H = 100 Oe, implying a superior DC-bias properties. More importantly, with the increases of x content, the value of μ<subscript>H</subscript>/μ<subscript>H</subscript><subscript>=</subscript><subscript>0</subscript> increases and reaches 87% for sample x = 0.5 at H = 100 Oe. The improvement of soft magnetic properties of the Fe-based antiperovskite Cu<subscript>x</subscript>NFe<subscript>4−x</subscript> is encouraging for future applications as functional materials. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09574522
Volume :
30
Issue :
11
Database :
Complementary Index
Journal :
Journal of Materials Science: Materials in Electronics
Publication Type :
Academic Journal
Accession number :
136694375
Full Text :
https://doi.org/10.1007/s10854-019-01377-y