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Effect of Cu on microstructure, magnetic properties of antiperovskite nitrides CuxNFe4−x.
- Source :
- Journal of Materials Science: Materials in Electronics; Jun2019, Vol. 30 Issue 11, p10383-10390, 8p
- Publication Year :
- 2019
-
Abstract
- For soft magnetic materials, especially new intermetallic compounds, some good soft magnetic properties, such as high permeability, low power loss, as well as superior DC-bias properties, will determine their prospects for application. In this paper, we report soft magnetic properties of Cu<subscript>x</subscript>NFe<subscript>4−x</subscript>, prepared by a new synthetic method. Although the saturation magnetization of the samples is slightly lower than that of Fe<subscript>4</subscript>N due to Cu doping, various other experimental results clearly provide evidence that the Fe substitution by Cu leads to the optimization and improvement of soft magnetic properties in Fe<subscript>4</subscript>N. With increasing Cu content, the permeability increases and power loss reduces from 1064.5 mW/cm<superscript>3</superscript> for x = 0.1 to 679 mW/cm<superscript>3</superscript> for x = 0.5 at H = 8 A/m, f = 1000 kHz. Additionally, the value of DC-bias (μ<subscript>H</subscript>/μ<subscript>H</subscript><subscript>=</subscript><subscript>0</subscript>) rises above 82% at H = 100 Oe, implying a superior DC-bias properties. More importantly, with the increases of x content, the value of μ<subscript>H</subscript>/μ<subscript>H</subscript><subscript>=</subscript><subscript>0</subscript> increases and reaches 87% for sample x = 0.5 at H = 100 Oe. The improvement of soft magnetic properties of the Fe-based antiperovskite Cu<subscript>x</subscript>NFe<subscript>4−x</subscript> is encouraging for future applications as functional materials. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09574522
- Volume :
- 30
- Issue :
- 11
- Database :
- Complementary Index
- Journal :
- Journal of Materials Science: Materials in Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 136694375
- Full Text :
- https://doi.org/10.1007/s10854-019-01377-y