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Automated Hybrid 3-D Printing of 3-D Meandering Interconnects.

Authors :
Robles, Ubaldo
Kudzal, Andelle
Rumpf, Raymond C.
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology; Jun2019, Vol. 9 Issue 6, p1184-1189, 6p
Publication Year :
2019

Abstract

In this paper, a completely automated computer-aided design (CAD)-to-print process flow for hybrid direct-write 3-D printing (3DP) was produced. We adapted this capability to manufacture a meandering conductive trace formed into a meandering arbitrary interconnect in the shape of a 3-D pretzel that is completely embedded in dielectric. The conversion between g-code and pgm-code was demonstrated for hybrid 3DP between metal and dielectric materials. This paper produced a reliable automated process that can potentially be used to manufacture arbitrary 3-D circuits. This paper also identified the need for better slicing techniques for hybrid manufacturing of interconnects. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
9
Issue :
6
Database :
Complementary Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
136890722
Full Text :
https://doi.org/10.1109/TCPMT.2019.2909979