Study on microstructure of Al/SnPb composite interface.

The Al/SnPb composite layer was prepared by brushing a layer of SnPb alloy on the surface of Al by mechanical rupture and induction heating. The binding interface was characterized by polarized light microscopy (PM), scanning electron microscopy (SEM), high resolution transmission electron microscopy (HRTEM) and X-ray energy spectroscopy (EDS). The results show that the bonding interface of Al/SnPb composites was good, and the microscopic interface exhibited a distinct transitional state. The bonding interface was jagged and had a small amount of Al-Sn supersaturated solution. The Al matrix was effectively bonded to the Sn-Pb alloy through the transition layer. [ABSTRACT FROM AUTHOR]