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The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings.
- Source :
- Journal of Electronic Materials; Jan2020, Vol. 49 Issue 1, p1-12, 12p
- Publication Year :
- 2020
-
Abstract
- The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7Cu solder alloy results in an improvement in the wettability based on dipping tests. The solderability investigation using a globule mode shows the influence of Ni and Bi on the interfacial intermetallic compound (IMC). The addition of Ni to a Sn-0.7Cu solder coating resulted in a (Cu,Ni)<subscript>6</subscript>Sn<subscript>5</subscript> interfacial IMC, which enhanced the solderability performance during the globule test. With an increasing amount of Bi in the Sn-0.7Cu-0.05Ni-xBi solder ball, the surface energy of the solder alloy can be reduced, and this improves the solderability. The synchrotron micro-XRF results indicate that Ni is found in a relatively high concentration in the interfacial layer. Additionally, Bi was found to be homogenously distributed in the bulk solder, which improved solderability. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 03615235
- Volume :
- 49
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- Journal of Electronic Materials
- Publication Type :
- Academic Journal
- Accession number :
- 140454645
- Full Text :
- https://doi.org/10.1007/s11664-019-07596-7