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Experimental and Numerical Study Upon Uniformity of Impingement Cooling With Pin-Fin Heat Sink.
- Source :
- IEEE Transactions on Components, Packaging & Manufacturing Technology; Jan2020, Vol. 10 Issue 1, p88-98, 11p
- Publication Year :
- 2020
-
Abstract
- In this paper, the impingement cooling performance on pin-fin heat sinks is experimentally and numerically investigated with different outlet arrangements and pin-fin layouts. Compared with one-way opening arrangement, results show that the two-way opening arrangement can offer a much lower pressure loss ($\Delta p$) due to shorter flow distance of airflow from outer jets. Meanwhile, it is surprising that the two-way opening arrangement still offers appreciable improvements on effective heat transfer coefficient ($h_{\mathrm {eff}}$). This is because the fountain may shift toward the outer jets more rapidly with one-way opening arrangement. Yet the implementation of staggered pin-fin layout has minor improvement on $h_{\mathrm {eff}}$. However, $\Delta p$ can be obviously reduced by 11.1% due to the more effective spreading of impinging airflow in radial direction. The $h_{\mathrm {eff}}$ value can be further increased by 8.8% when a smaller jet-to-target distance is applied. With priority consideration of hot spots in electronic cooling, the nonuniformity of local Nusselt number (${S}$) is further studied through the computational fluid dynamics (CFD) method. ${S}$ approaches 18.5% when the airflow directly impinges on a flat surface with optimized jet array. Implementing pin-fin heat sinks can reduce the nonuniformity of Nusselt number distribution to fall below 8.0%. The nonuniformity of local Nusselt number can be further reduced to 1.8% by applying four-way opening arrangement and larger central jet at the same time. [ABSTRACT FROM AUTHOR]
- Subjects :
- HEAT transfer coefficient
COMPUTATIONAL fluid dynamics
HEAT
DENTAL resins
UNIFORMITY
Subjects
Details
- Language :
- English
- ISSN :
- 21563950
- Volume :
- 10
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Components, Packaging & Manufacturing Technology
- Publication Type :
- Academic Journal
- Accession number :
- 141257008
- Full Text :
- https://doi.org/10.1109/TCPMT.2019.2926406