Mode I Fracture Toughness Evaluation of Adhesively Bonded Joints via J‐Integral and DIC.

Amorphous polymers, such as epoxy resins, are commonly used in the realization of adhesively bonded joints. In this paper an evaluation of mode I fracture toughness of bonded joints is presented. Moreover, an identification of cohesive zone model parameters via Rice's J‐integral is described. Experimental tests are performed on double cantilever beam specimens and relative displacements between adherends are acquired by using the digital image correlation technique. The obtained interface law can be implemented in a finite element code for simulating the decohesion process of complex bonded structures. [ABSTRACT FROM AUTHOR]