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Mission Profile-Based System-Level Reliability Prediction Method for Modular Multilevel Converters.
- Source :
- IEEE Transactions on Power Electronics; Jul2020, Vol. 35 Issue 7, p6916-6930, 15p
- Publication Year :
- 2020
-
Abstract
- This article proposes a mission profile-based reliability prediction method for modular multilevel converters (MMCs). It includes key modeling steps, such as long-term mission profile, analytical power loss models, system-level and component-level thermal modeling, lifetime modeling, Monte Carlo analysis, and redundancy analysis. Thermal couplings and uneven thermal stresses among submodules are considered. A case study of a 15-kVA down-scale MMC has been used to demonstrate the proposed method and validate the theoretical analysis. The outcomes serve as a first step for developing realistic reliability analysis and model-based design methods for full-scale MMCs in practical applications. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 08858993
- Volume :
- 35
- Issue :
- 7
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Power Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 142344931
- Full Text :
- https://doi.org/10.1109/TPEL.2019.2957826