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Non-Contact Degradation Evaluation for IGBT Modules Using Eddy Current Pulsed Thermography Approach.

Authors :
Liu, Xingliang
Tian, Guiyun
Chen, Yu
Luo, Haoze
Zhang, Jian
Li, Wuhua
Source :
Energies (19961073); 5/15/2020, Vol. 13 Issue 10, p2613, 1p, 11 Diagrams, 3 Charts, 4 Graphs
Publication Year :
2020

Abstract

In this paper, a non-contact degradation evaluation method for insulated gate bipolar transistor (IGBT) modules is proposed based on eddy current pulsed thermography approach. In non-contact heat excitation procedures, a high-power induction heater is introduced to generate heat excitation in IGBT modules. The thermographs of the whole temperature mapping are recorded non-invasively by an IR camera. As a result, the joint degradation of IGBT modules can be evaluated by the transient thermal response curves derived from the recorded thermographs. Firstly, the non-destructive evaluation principle of the eddy current pulsed thermography (ECPT) system for an IGBT module with a heat sink is introduced. A 3D simulation module is built with physical parameters in ANSYS simulations, and then thermal propagation behavior considering the degradation impact is investigated. An experimental ECPT system is set up to verify the effectiveness of the proposed method. The experimental results show that the delay time to peak temperature can be extracted and treated as an effective indicative feature of joint degradation. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
19961073
Volume :
13
Issue :
10
Database :
Complementary Index
Journal :
Energies (19961073)
Publication Type :
Academic Journal
Accession number :
143637590
Full Text :
https://doi.org/10.3390/en13102613