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Full Duplex Component-Forward Cooperative Communication for a Secure Wireless Communication System.

Authors :
Khan, Rabia
Jayakody, Dushantha Nalin K.
Source :
Electronics (2079-9292); Dec2020, Vol. 9 Issue 12, p2102, 1p
Publication Year :
2020

Abstract

The technological breakthrough in the form of Internet of Things (IoT), Big data and connected world is increasing the demand of better spectrum utilization. Half-Duplex (HD) transmission is mostly used in the earlier communication systems. The high transmission demand requires the better utilization of the existing spectrum. There are several possible ways to overcome the problem of better spectrum usage. In-Band Full Duplex (IBFD) is one of the techniques that can double the Spectral Efficiency (SE) in a Beyond 5G (B5G) communication system. In this paper, our aim is to use the spectral efficient IBFD scheme to improve the security of the system with minimum interference. The interference can be reduced by the addition of orthogonality between the transmitted and received signal of a relay. A component-forward scheme is proposed in this paper to create such orthogonality. For achieving the desired aim, IBFD is used with Device-to-Device (D2D), Artificial Noise (AN), Modulation based orthogonalization, Radio Frequency Energy Harvesting (RFEH) and proposed Full-Duplex Component Forward (FD-CF) algorithm for multiple relays. We also use non-linear harvested power as one of the sources to reuse the exiting power for evaluating the system performance. The derivation of Secrecy Outage Probability (SOP) and throughput is derived in this paper for the FD-CF cooperative communication and is explored with and without non-linear RFEH. The simulation results show the comparison between the component-forward and decode-and-forward communication with one or more relays. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
20799292
Volume :
9
Issue :
12
Database :
Complementary Index
Journal :
Electronics (2079-9292)
Publication Type :
Academic Journal
Accession number :
147803952
Full Text :
https://doi.org/10.3390/electronics9122102