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Compact flip‐chip interconnection 8 × 50 Gbit/s EADFB laser array module for 400 Gbit/s transceiver.
- Source :
- Electronics Letters (Wiley-Blackwell); Mar2014, Vol. 50 Issue 7, p533-534, 2p
- Publication Year :
- 2014
-
Abstract
- The first compact electroabsorption modulators integrated with distributed‐feedback (EADFB) laser array module using flip‐chip interconnects have been fabricated for a 400 Gbit/s transceiver. Eight 50 Gbit/s EADFB lasers and an optical multiplexer were monolithically integrated on one chip in an area of only 3.2 × 4.8 mm. The flip‐chip interconnects provide a higher modulation bandwidth. Clear eye opening was achieved for all eight lanes under 50 Gbit/s operation. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00135194
- Volume :
- 50
- Issue :
- 7
- Database :
- Complementary Index
- Journal :
- Electronics Letters (Wiley-Blackwell)
- Publication Type :
- Academic Journal
- Accession number :
- 148780772
- Full Text :
- https://doi.org/10.1049/el.2013.4276