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Steady-state methods for measuring in-plane thermal conductivity of thin films for heat spreading applications.
- Source :
- Review of Scientific Instruments; Apr2021, Vol. 92 Issue 4, p1-12, 12p
- Publication Year :
- 2021
-
Abstract
- The development of high thermal conductivity thin film materials for the thermal management of electronics requires accurate and precise methods for characterizing heat spreading capability, namely, in-plane thermal conductivity. However, due to the complex nature of thin film thermal property measurements, resolving the in-plane thermal conductivity of high thermal conductivity anisotropic thin films with high accuracy is particularly challenging. Capable transient techniques exist; however, they usually measure thermal diffusivity and require heat capacity and density to deduce thermal conductivity. Here, we present an explicit uncertainty analysis framework for accurately resolving in-plane thermal conductivity via two independent steady-state thermometry techniques: particle-assisted Raman thermometry and electrical resistance thermometry. Additionally, we establish error-based criteria to determine the limiting experimental conditions that permit the simplifying assumption of one-dimensional thermal conduction to further reduce thermal analysis. We demonstrate the accuracy and precision (<5% uncertainty) of both steady-state techniques through in-plane thermal conductivity measurements of anisotropic nanocrystalline diamond thin films. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00346748
- Volume :
- 92
- Issue :
- 4
- Database :
- Complementary Index
- Journal :
- Review of Scientific Instruments
- Publication Type :
- Academic Journal
- Accession number :
- 150105340
- Full Text :
- https://doi.org/10.1063/5.0039966