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A Low-Loss Broadband Planar Transition From Ground Coplanar Waveguide to Substrate-Integrated Coaxial Line.

Authors :
Yang, Shilin
Yu, Zhiqiang
Zhou, Jianyi
Source :
IEEE Microwave & Wireless Components Letters; Nov2021, Vol. 31 Issue 11, p1191-1194, 4p
Publication Year :
2021

Abstract

In this letter, a three-dimensional ground coplanar waveguide (3D-GCPW) structure is proposed as a broadband planar transition between the conventional GCPW and substrate integrated coaxial line (SICL). The proposed 3D-GCPW contains a 3-D central conductor constructed by two copper layers which are connected together by metallized blind vias and two side ground planes. Its characteristic impedance is mainly determined by the width of the 3-D central conductor and the gap to the side ground plane; thus, the requirement for machining accuracy of metallized blind vias in 3D-GCPW can be reduced during the machining process. A back-to-back structure of the 3D-GCPW transition is fabricated by a multilayer printed circuit board (PCB) process and measured to validate the good performance. The experimental results show that the proposed 3D-GCPW transition exhibits a reflection coefficient less than −10 dB and an acceptable insertion loss within dc to 42 GHz, making it promising for high-performance multiple-channel transceiver or massive integrated applications. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
15311309
Volume :
31
Issue :
11
Database :
Complementary Index
Journal :
IEEE Microwave & Wireless Components Letters
Publication Type :
Academic Journal
Accession number :
153761945
Full Text :
https://doi.org/10.1109/LMWC.2021.3079439