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Mechanism of and Key Technologies for Copper Bonding in the Hot Rolling of SCR Continuous Casting and Rolling.
- Source :
- Applied Sciences (2076-3417); Nov2021, Vol. 11 Issue 22, p11023, 16p
- Publication Year :
- 2021
-
Abstract
- In the process of copper alloy hot continuous rolling, the problem of copper sticking to the roller seriously affects the surface quality, performance, and service life of the copper products. Roll sticking occurs as the adhesion energy of Cu is lower than that of Fe and the Fe-Cu interface, and the severe surface deformation which forces the copper into direct contact with the roll during the process of profile rolling. Based on the copper deformation law and adhesion phenomenon in the hot continuous rolling process, a rolling deformation model and roll copper adhesion model or copper alloy hot continuous rolling were established, and their simulation was realized using finite element software. Through finite element modeling of the hot rolling deformation zone, the distribution of the temperature, contact normal stress, and exposure rate in the hot rolling deformation zone were obtained, which were consistent with the actual roll adhesion phenomenon and copper adhesion position. To address the copper sticking behavior of the rolls, the process optimization method of matching the motor speed with the elongation coefficient (the 1# and 2# motor speeds were adjusted to 1549 r/min and 1586 r/min, respectively), adjusting the roll gap to 7.9 mm, and increasing the number and pressure of roll spray nozzles were put forward, which effectively solved the problem of copper sticking to the roll, significantly improved the surface quality of the copper and the service life of the roll, and can be used in production. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 20763417
- Volume :
- 11
- Issue :
- 22
- Database :
- Complementary Index
- Journal :
- Applied Sciences (2076-3417)
- Publication Type :
- Academic Journal
- Accession number :
- 153790583
- Full Text :
- https://doi.org/10.3390/app112211023