Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study.

MLA

Anduix, Canto, Clara, et al. “Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study.” Advanced Materials Interfaces, vol. 9, no. 1, Jan. 2022, pp. 1–10. EBSCOhost, https://doi.org/10.1002/admi.202101447.

APA

Anduix, C. C., Peral, D., Pérez, P. V., Diaz, R. A. M., Belmez Lledó, A., Orme, C. A., Petrash, S., Engels, T., & Chou, K. W. (2022). Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study. Advanced Materials Interfaces, 9(1), 1–10. https://doi.org/10.1002/admi.202101447

Chicago

Anduix, Canto, Clara, Daniel Peral, Padilla, Víctor Pérez, Rovira, Anna Maria Diaz, Alejandro Belmez Lledó, Christine A. Orme, Stanislas Petrash, Thomas Engels, and Kang Wei Chou. 2022. “Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study.” Advanced Materials Interfaces 9 (1): 1–10. doi:10.1002/admi.202101447.