Toward scalable fabrication of electrochemical paper sensor without surface functionalization.

MLA

Wang, Cheng, et al. “Toward Scalable Fabrication of Electrochemical Paper Sensor without Surface Functionalization.” NPJ Flexible Electronics, vol. 6, no. 1, Feb. 2022, pp. 1–8. EBSCOhost, https://doi.org/10.1038/s41528-022-00143-1.

APA

Wang, C., Wu, R., Ling, H., Zhao, Z., Han, W., Shi, X., Payne, G. F., & Wang, X. (2022). Toward scalable fabrication of electrochemical paper sensor without surface functionalization. NPJ Flexible Electronics, 6(1), 1–8. https://doi.org/10.1038/s41528-022-00143-1

Chicago

Wang, Cheng, Rui Wu, Hao Ling, Zhiling Zhao, Wenjia Han, Xiaowen Shi, Gregory F. Payne, and Xiaohui Wang. 2022. “Toward Scalable Fabrication of Electrochemical Paper Sensor without Surface Functionalization.” NPJ Flexible Electronics 6 (1): 1–8. doi:10.1038/s41528-022-00143-1.