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Preparation and characterization of soluble heat-resistant polyimide films containing bis-N-phenyl-benzimidazole.

Authors :
Li, Dandan
Wang, Chengyang
Ma, Shengqi
Zhou, Hongwei
Lu, Ran
Source :
High Performance Polymers; Mar2022, Vol. 34 Issue 2, p197-208, 12p
Publication Year :
2022

Abstract

To prepare soluble polyimides with high temperature resistance, two new diamine monomers, namely, 2,2<superscript>′</superscript>-(4,4<superscript>′</superscript>-oxybisphenylene)-bis(1-phenyl-5-aminobenzimidazole) (5a), and 2,2<superscript>′</superscript>-(4,4<superscript>′</superscript>-hexafluoroisopropylidene)-bis(1-phenyl-5- aminobenzimidazole) (5b), were synthesized and exploited to prepare three series of poly(benzimidazole imides)s (PBIIs) by a conventional two-stage synthesis. The resulting PI films were flexible and tough, possessing high glass-transition temperatures (T<subscript>g</subscript>s = 311°C–390°C), improved optical transparency, and excellent solubility. Moreover, the effect of different configuration on performance was revealed, and these data provided a feasible method to enhance both T<subscript>g</subscript> and solubility of PIs by incorporating N-phenyl benzimidazole and corresponding functional moieties. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
09540083
Volume :
34
Issue :
2
Database :
Complementary Index
Journal :
High Performance Polymers
Publication Type :
Academic Journal
Accession number :
155282757
Full Text :
https://doi.org/10.1177/09540083211036326