Back to Search Start Over

RF MEMS switch with double-clamp and wafer level package with through silicon vias for integration RF MEMS in applications 5G and internet of things.

Authors :
Tkachenko, Alexey V.
Lysenko, Igor E.
Kovalev, Andrey V.
Source :
Proceedings of SPIE; 5/4/2022, Vol. 12157, p121570H-121570H-12, 1p
Publication Year :
2022

Details

Language :
English
ISSN :
0277786X
Volume :
12157
Database :
Complementary Index
Journal :
Proceedings of SPIE
Publication Type :
Conference
Accession number :
155358891
Full Text :
https://doi.org/10.1117/12.2624586