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RF MEMS switch with double-clamp and wafer level package with through silicon vias for integration RF MEMS in applications 5G and internet of things.
- Source :
- Proceedings of SPIE; 5/4/2022, Vol. 12157, p121570H-121570H-12, 1p
- Publication Year :
- 2022
Details
- Language :
- English
- ISSN :
- 0277786X
- Volume :
- 12157
- Database :
- Complementary Index
- Journal :
- Proceedings of SPIE
- Publication Type :
- Conference
- Accession number :
- 155358891
- Full Text :
- https://doi.org/10.1117/12.2624586