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TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning.
- Source :
- IEEE Transactions on Semiconductor Manufacturing; May2022, Vol. 35 Issue 2, p372-374, 3p
- Publication Year :
- 2022
-
Abstract
- Wafer failure pattern recognition can be used for root cause analysis, which is very important for yield learning. Recently, TestDNA was proposed to improve diagnosis resolution with data collected from wafer test. Previous studies on wafer failure pattern recognition using machine learning achieve good classification results. In this letter, we propose to enhance the classification accuracy with the help of spatial information and ensemble learning algorithms. Experimental results indicate that the proposed method can further improve the accuracy by 8.9%. [ABSTRACT FROM AUTHOR]
- Subjects :
- PATTERN recognition systems
ROOT cause analysis
Subjects
Details
- Language :
- English
- ISSN :
- 08946507
- Volume :
- 35
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Semiconductor Manufacturing
- Publication Type :
- Academic Journal
- Accession number :
- 156741933
- Full Text :
- https://doi.org/10.1109/TSM.2022.3145855