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Comparative Evaluation of the Two Multilevel Concepts With Full ZVS Operation Employing WBG Devices for Use in 1500-V PV Systems.

Authors :
Stevanovic, Branislav
Salinas, Guillermo
Alou, Pedro
Cobos, Jose Antonio
Vasic, Miroslav
Source :
IEEE Transactions on Industry Applications; May/Jun2022, Vol. 58 Issue 3, p3922-3935, 14p
Publication Year :
2022

Abstract

A multi-level boost topology based on a flying capacitor is compared in this work with the hybrid, multi-level, partial power processing topology already presented in the literature for use as a highly efficient and compact dc/dc stage in 1500-V, two-stage, grid-connected PV systems. Different variations of the resonant stage of the hybrid topology are analyzed and compared in terms of losses, volume and complexity. Full multivariable optimization is conducted for the multi-level boost topology with different number of levels and for all the analyzed variations of the resonant stage of the hybrid topology. Appropriately rated new classes of 650-V and 900-V WBG devices are included in the optimization algorithm. It is concluded that due to the dominant conduction losses and gap in the voltage rating of the commercially available WBG devices between 650V and 200V, increase of the number of levels over 4 leads to the deteriorated loss and volume performances. All the analysis related to the resonant stage of the hybrid topology is confirmed by detailed and comprehensive measurements of two prototypes of 4kW of nominal and 7kW of maximal power. Additionally, all the loss models applied in the optimization algorithms presented in this paper are confirmed by detailed measurements, thermal calibration and finite element thermal simulations of the wide bandgap devices and inductor designs employed in this work. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00939994
Volume :
58
Issue :
3
Database :
Complementary Index
Journal :
IEEE Transactions on Industry Applications
Publication Type :
Academic Journal
Accession number :
157007386
Full Text :
https://doi.org/10.1109/TIA.2022.3156123