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Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process.

Authors :
Flechsig, Christian
Lohmer, Jacob
Lasch, Rainer
Zettler, Benjamin
Schneider, Germar
Eberts, Dietrich
Source :
IEEE Transactions on Semiconductor Manufacturing; Aug2022, Vol. 35 Issue 3, p397-404, 8p
Publication Year :
2022

Abstract

Lot-to-order matching (LTOM) is a crucial process in semiconductor manufacturing since inefficient allocation and order release have strong adverse effects on factory performance. Although prior research proposes several heuristics for the mathematical optimization of the LTOM process, successful real-world implementations following practical and comprehensive approaches are scarce. Our longitudinal case study addresses that issue by summarizing the results of an extensive research project on the automation and optimization of the LTOM process for 200 mm and 300 mm wafers at Infineon Technologies Dresden. Grounded in Action Design Research, we integrated different research methods to provide meaningful insights into the benefits, challenges, and best practices of our approach. Thereby, we also compare the results for 200 mm and 300 mm wafers. The project had positive impacts on multiple quantitative and qualitative key performance indicators, e.g., throughput, on-time delivery, tool utilization, cycle and working time savings, collaboration, and employee satisfaction. Finally, we provide managerial guidance for similar projects and implications for future research. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
08946507
Volume :
35
Issue :
3
Database :
Complementary Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
158405932
Full Text :
https://doi.org/10.1109/TSM.2022.3184041