Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio.

MLA

Kim, Taeyeong, and Jungchul Lee. “Optimization of Deep Reactive Ion Etching for Microscale Silicon Hole Arrays with High Aspect Ratio.” Micro & Nano Systems Letters, vol. 10, no. 1, Sept. 2022, pp. 1–7. EBSCOhost, https://doi.org/10.1186/s40486-022-00155-6.

APA

Kim, T., & Lee, J. (2022). Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio. Micro & Nano Systems Letters, 10(1), 1–7. https://doi.org/10.1186/s40486-022-00155-6

Chicago

Kim, Taeyeong, and Jungchul Lee. 2022. “Optimization of Deep Reactive Ion Etching for Microscale Silicon Hole Arrays with High Aspect Ratio.” Micro & Nano Systems Letters 10 (1): 1–7. doi:10.1186/s40486-022-00155-6.