Tribological Behavior of Electrical Connector Sn/Ni/Cu Coating with Intermetallic Compound Layers Under Reciprocating Motion.

Electroplating is one of the most common methods for applying electronic connector coatings. This research investigated the tribological behavior of electroplated multilayer coatings of Sn, Ni, and Cu with and without intermetallic compound layers (IMC), which are intermediate compounds formed between two metals under reciprocating sliding. It is found that heat treatment promotes both Sn/Ni IMC and Sn/Cu IMC growth. Based on the test results, the tribological performance of all heat‐treated samples is enhanced due to the high hardness of the IMC. The existence of the Ni layer slows the formation of IMC between the Sn and Cu coatings, but it is not producing a significant improvement from the perspective of tribological performance. [ABSTRACT FROM AUTHOR]